High-efficiency Photolithography Baking Solution — WH-HP-02/03 Multi-Zone Baking Hot Plate
In micro-nano fabrication and photolithography processes, the temperature consistency and efficiency of photoresist baking (soft bake, intermediate bake, post bake) directly determine patterning quality and process repeatability. Conventional single-zone baking hot plates require frequent temperature rise and fall when multiple temperature setpoints are needed, which is time-consuming and prone to introducing process errors.
Launched by Hanyi Co., Ltd., the WH-HP-02 (7-inch) and WH-HP-03 (5-inch) multi-zone baking hot plates adopt an innovative three independent temperature zone control design, upgrading the laboratory photoresist baking experience.
Three Core Advantages
1. Three Independently Controllable Zones, Greatly Improved Efficiency
The equipment is equipped with three independent temperature control zones, which can be set to different temperatures and operated simultaneously or individually.
For instance, soft bake (90℃), intermediate bake (110℃) and post bake (120℃) can be performed at the same time without waiting for temperature switching. The single-batch processing time is reduced by over 50%. Each zone operates without mutual thermal interference, ensuring consistent process performance.
2. Precise PID Temperature Control with Excellent Repeatability
Adopting a PID closed-loop temperature control system, it achieves temperature control accuracy of ±1℃ and temperature uniformity within ±5%. It features fast heating rate and high long-term operating stability. The touchscreen interface supports segmented programmable temperature profile setting, enabling easy configuration of complex baking procedures.
3. Compatible with Mainstream Spin Coaters for One-Stop Thin Film Preparation
The WH-HP series hot plates are perfectly compatible with KW-4A and WH-SC-01 spin coaters, forming an ideal matching solution for the preparation of metal oxide thin films, polymer coatings and metal-organic thin films.
Compared with traditional drying ovens, the hot plate delivers uniform bottom-up heating to avoid the “skin effect”. It shortens baking time several times and produces denser and more uniform film layers.
Quick Overview of Technical Specifications
表格
| Model | Applicable Substrate | Temperature Range | Power | Overall Dimension | Weight |
|---|---|---|---|---|---|
| WH-HP-02 | Φ210 mm | Room Temperature ~ 300℃ | 2.5 kW | 580×706×187 mm | 40 kg |
| WH-HP-03 | Φ130 mm | Room Temperature ~ 300℃ | 1.5 kW | 480×580×200 mm | 21 kg |
Both models adopt AC220V power supply and touchscreen operation with built-in PID algorithm for stable continuous operation. The compact structure saves laboratory space, making it an ideal choice for research institutes, semiconductor manufacturers and university photolithography laboratories.
Typical Application Scenarios
- Photoresist soft bake, post bake and hard bake
- Heat treatment of sol-gel thin films
- Curing of polymer coatings
- Annealing of organometallic thin films
Click to download the full manual and start a new experience of efficient and precise multi-zone photoresist baking.
Note: All product parameters are sourced from public documents of Hanyi Co., Ltd. Model selection and application shall be determined according to actual process requirements.
