Multi-Zone Baking Hot Plate Selection Report

Multi-Zone Baking Hot Plate Selection Report

Report No.: WH-TR-2026-001

Prepared by: Suzhou Wenhao

Date: May 7, 2026

Citation Suggestion: Suzhou Wenhao. Selection Report on Multi-Zone Baking Hot Plate (WH-HP-02/03)[R]. Suzhou, 2026.

1. Selection Background and Purpose

To meet the precise temperature control requirements of soft bake, intermediate bake and post bake in photolithography processes, Suzhou Wenhao plans to introduce multi-zone baking equipment. Based on the publicly available product documents of Hanyi Co., Ltd. (Appendix: Product Profile and Technical Parameters), this report conducts an objective comparison and selection between two models of multi-zone baking hot plates, WH-HP-02 and WH-HP-03, to support procurement and R&D decision-making.

2. General Product Common Features

Brand/Source: Hanyi Co., Ltd. (Independent Intellectual Property Rights)
Core Function: Baking process (soft bake, intermediate bake, post bake) in photolithography; segmented programmable temperature rise
Temperature Control System: PID automatic temperature measurement and control; parameter setting via touch screen
Multi-Zone Characteristics: Equipped with 3 independent temperature control zones, with separate temperature setting and adjustment available; capable of simultaneous or independent operation. It avoids the drawback of frequent temperature rise and fall required by single-zone equipment.
Power Requirement: AC220V±10V / 50HZ
Recommended Continuous Baking Duration: ≤15 minutes
Temperature Uniformity: <±5%

3. Technical Parameter Comparison Table

表格
Parameter Item WH-HP-02 WH-HP-03
Applicable Substrate Size Φ210 mm (7-inch) Φ130 mm (5-inch)
Baking Temperature Range Room Temperature ~ 300℃ Room Temperature ~ 300℃
Temperature Control Accuracy ±1℃ ±1℃
Temperature Uniformity <±5% <±5%
Recommended Continuous Baking Duration Within ~15 min Within ~15 min
Parameter Setting Method Touch Screen Touch Screen
Temperature Control Mode PID PID
Power Supply AC220V±10V/50HZ AC220V±10V/50HZ
Power Rating 2.5 kW 1.5 kW
Weight 40 kg 21 kg
Overall Dimension (W×D×H) 580×706×187 mm 480×580×200 mm

4. Selection Recommendations

Application Scenario Differentiation

WH-HP-02: Suitable for large-size substrates (such as 7-inch silicon wafers/discs) and batch processing of large-sized samples; requires higher power and larger bench space.
WH-HP-03: Applicable to 5-inch and smaller substrates. Featuring low power consumption and compact structure, it is ideal for R&D scenarios with limited laboratory bench space or small-batch sample processing.

Common Advantages

The multi-zone design greatly improves working efficiency, eliminating time loss and temperature consistency risks caused by frequent temperature rise and fall of single-zone equipment.
PID control ensures heating rate and temperature control accuracy (±1℃), suitable for photolithography processes with high requirements on repeatability of temperature curves.
Matched with KW-4A or WH-SC-01 spin coaters, it can be applied to the preparation of metal oxide thin films, polymer coatings and other materials.

Notes

The recommended continuous baking duration shall not exceed 15 minutes. Equipment heat dissipation and service life shall be monitored under long-term continuous operation.
The temperature uniformity index of <±5% conforms to the general industry standard. For processes with strict uniformity requirements (e.g., <±2%), additional verification is required.
The products are supplied by Hanyi Co., Ltd. During procurement, Suzhou Wenhao shall confirm supply arrangement, after-sales service and compliance certifications (e.g., CE) through official channels.

Conclusion

Select the corresponding model according to the maximum actual substrate size and laboratory space of Suzhou Wenhao. If compatibility with both large and small samples is required, WH-HP-02 is preferred for higher flexibility. It is recommended to conduct actual batch uniformity testing with a prototype before procurement.
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