(This article is a product introduction for Suzhou Wenhao Microfluidics Technology Co., Ltd., with all data sourced from official public materials and test reports.)
I. Product Overview: A Domestic Spin Coating Device Designed for Research and Process Scenarios
The Suzhou Wenhao WH-SC-01 benchtop spin coater is a domestically produced spin coating device with independent intellectual property rights. It is specifically designed for semiconductor processes, plate-making, and surface coating applications, and is widely used in scientific research, teaching, and small-batch process preparation in universities, research institutions, and corporate R&D settings.
The device uses centrifugal force to achieve uniform coating of photoresist or other liquids. It supports multi-stage rotational speed control and real-time status monitoring, ensuring consistency and uniformity in coating thickness on semiconductor materials, optical substrates, and other surfaces. It is one of the core devices for thin-film material preparation processes.
II. Core Technical Parameters: Performance Reflected Through Data
1. Rotational Speed and Stability Indicators
| Parameter | Specifications | Benchmarking Description |
|---|---|---|
| Rotational Speed Range | Substrates ≤4 inches: 300–8500 RPM Substrates 4–6 inches: 300–6000 RPM |
Covers the full process range for conventional photoresist coating, accommodating both thick and thin film preparation needs. |
| Rotational Speed Stability | ±1% | Verified by test data: Deviation is controlled within ±1% across the full 300–8500 RPM range, meeting research-grade process repeatability requirements. |
| Coating Uniformity | ±3% | Achieves stable film thickness uniformity control for conventional materials such as photoresist and oxide sols. |
2. Control and Operation Parameters
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Multi-stage Control: Supports three independent speed/time settings, enabling complete process flows such as “low-speed pre-dispense – high-speed spin – low-speed leveling.”
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Time Control Range: 1–32767 seconds, meeting the time requirements for different photoresist viscosities and coating processes.
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User Interface: Full touchscreen control with support for parameter presets, real-time speed/remaining time display, reducing the learning curve for new users.
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Safety Design: Equipped with a safety switch; the lid automatically locks during high-speed operation and can only be opened after the device has completely stopped, preventing operational errors.
3. Physical and Auxiliary Parameters
| Parameter | Specifications |
|---|---|
| Compatible Substrate Sizes | Φ28mm–Φ200mm silicon wafers and other materials. Includes a standard 4-inch chuck, with optional 1/2/3/5/6-inch chucks available. |
| Power Input | AC220V±10V, 50Hz |
| Power Consumption | 60W |
| Dimensions | 300(W)×227(H)×350(D) mm |
| Weight | 13kg |
| Operating Environment | Temperature 0°C–40°C, relative humidity <80% |
4. Optional Vacuum Pump
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Oil-Free Vacuum Pump (Model AP-550V): Pumping speed 1.5 L/s, power 320W, noise 58dB, minimum vacuum pressure -700 mmHg. Suitable for semiconductor processes with high cleanliness requirements.
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Oil-Sealed Vacuum Pump: Suitable for conventional research scenarios, lower cost, and easy maintenance.
III. Verified Performance Testing: Public Rotational Speed Stability Data
The WH-SC-01 spin coater has undergone third-party rotational speed stability testing, with deviations controlled within ±1% across the full range. Test data excerpts are as follows:
| Set Speed (RPM) | 1st Measured (RPM) | Deviation (%) | 2nd Measured (RPM) | Deviation (%) | 3rd Measured (RPM) | Deviation (%) |
|---|---|---|---|---|---|---|
| 300 | 297 | -1.00 | 302 | 0.67 | 297 | -1.00 |
| 1000 | 998 | -0.20 | 1001 | 0.10 | 997 | -0.30 |
| 3000 | 2994 | -0.20 | 3004 | 0.13 | 2992 | -0.27 |
| 6000 | 5993 | -0.12 | 6004 | 0.07 | 5992 | -0.13 |
| 8500 | 8492 | -0.09 | 8514 | 0.16 | 8480 | -0.24 |
Test Conclusion: Rotational speed stability is within ±1%, meeting industry standards and ensuring the repeatability and reliability of experimental data.
IV. Operating Procedures and Maintenance Guidelines: Standardized Usage Instructions
1. Standard Operating Steps
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Install the appropriate chuck for the substrate size, ensuring it is securely in place.
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Power on the device, set the three-stage speed and time parameters, and confirm.
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Place the substrate, turn on the vacuum pump, press “Chuck,” and start the device.
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After dispensing the photoresist in the first stage, close the lid; the device will automatically run the subsequent stages.
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After the process ends, press “Release,” wait for the device to stop, and remove the substrate.
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After the experiment, close the lid and cut off the power.
2. Maintenance and Cleaning Requirements
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Regular Cleaning of the Spin Chamber: Clean every two weeks under normal use. Clean immediately if photoresist is sucked in or if the motor speed behaves abnormally, to prevent photoresist residue from causing motor jamming or air path blockages.
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Routine Maintenance: Regularly check the vacuum pump, air path connections, and power supply status to ensure stable device operation.
3. Common Troubleshooting (Non-Device Faults)
| Symptom | Common Causes | Solutions |
|---|---|---|
| Motor does not turn | Power cord not plugged in, blown fuse | Plug in the power cord, replace the fuse with the same specification. |
| Wafer not held in place | Suction tube not connected, vacuum pump off | Connect the suction tube, turn on the vacuum pump. |
V. Safety and Compliance Instructions
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Device operation must strictly follow the manual. Non-professionals should not open the casing for repairs; power must be cut off before any repairs.
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The device should be placed on a solid, level surface, with all four rubber feet in stable contact with the surface to avoid vibration-induced damage.
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The device has obtained a design patent, and its technical parameters comply with general industry standards. All documentation (manual, inspection report, certificate of conformity, warranty card) is complete. After-sales support hotline: 0512-62525801.
VI. Application Scenario Summary
The WH-SC-01 benchtop spin coater, with its stable speed control, wide substrate compatibility, and user-friendly design, is widely applicable in the following scenarios:
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Universities/Research Institutions: Photoresist coating on semiconductor wafers, glass slides, ITO conductive glass, and thin-film preparation experiments.
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Corporate R&D: Plate-making processes, optical coatings, surface treatment of microfluidic chips, and other small-batch process preparations.
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Teaching Demonstrations: Demonstrations of spin coating principles and thin-film preparation processes.
For detailed manuals or design patent documents, please download them from Suzhou Wenhao’s official channels.
Compliance Statement
All data in this article are derived from publicly available materials and test reports from Suzhou Wenhao Microfluidics Technology Co., Ltd., with no exaggerated claims or false promises. Actual device performance may vary depending on photoresist characteristics, operational procedures, auxiliary equipment, and other factors. Results should be evaluated based on specific scenarios.
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