The WH-HP-02 is a compact and easy-to-use photolithography hot plate. It is used in prebake, postbake, and hardbake of the photolithographic process. This product features high baking speed, uniformity, high temperature control accuracy, and highly repeatable experimental results. Baking control is designed for prebake, postbake, and hardbake for photo-etching process. Together with KW-4A spin-coater or WH-SC-01 spinner, the WH-HP-02 hot plate is a perfect tool to fabricate metal oxide thin films, polymer coatings and metal organic thin films on silicon wafers or other substrates. Ramp programmable control function available as an option.
Comparing with conventional ovens, using hotplates to cure the films will result in reduced baking time, increased reproducibility, and more uniform and better film quality. It is because the WH-HP-02 has a uniform temperature profile across the substrate and provides even heating to the films and coatings. The skin effect will be avoided since the films/coatings are heated from the bottom up.
Product Introduction
The multi-temperature zone glue bake station (WH-HP-02) is a product independently developed by Wenhao Co., Ltd. with independent intellectual property rights. It can be used in the glue baking process in the photolithography process, including pre-bake, middle-bake, and post-bake. And has segmented program-controlled heating. The equipment adopts PID temperature control system to automatically measure and control temperature. It has the characteristics of fast heating speed, uniform temperature and high-temperature control accuracy, and can work continuously and stably for a long time. In addition, the biggest feature of this instrument is that it has 3 temperature control areas, which can be set and adjusted for different temperatures and can work simultaneously/singly. This overcomes the fact that the conventional glue bake station has only one temperature control area, and multiple temperature controls must go back and forth. The shortcomings of switching between heating and cooling greatly improve the efficiency of glue drying and the temperature consistency of the glue drying process.
Technical Parameter
Bake glue temperature: room temperature～300℃;
Continuous baking time: ~15min or less;
Temperature control accuracy: ±1℃;
Temperature uniformity: <±5%;
Bake rubber sheet specifications: φ210 mm (7 inches); φ130 mm (5 inches)
Parameter setting: touch screen to set parameters;
Temperature control form: PID temperature control system;
Power input: AC220V±10V/50HZ;
Power: 2.5 KW/1.5KW;
Weight:40kg/21kg;
Dimensions: 580(W)*706(D)*187(H)mm; 480(W)*580(D)*200(H)mm
Feature Diagram
